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IEC60754-1:2011+AMD1:2019 电缆材料燃烧时释出气体的试验第1部分:卤酸气体含量的测定Test on gases evolved during combustion of materials from cables - Part 1: Determination of the halogen acid gas content

IEC60754-1:2011 取自电缆或光缆的材料燃烧时释出气体的试验方法第1部分:卤酸气体量的测定Test on gases evolved during combustion of materials from cables - Part 1: Determination of the halogen acid gas content

IEC60754-1:1994 取自电缆或光缆的材料燃烧时释出气体的试验方法第1部分:卤素气体总量的测定Test on gases evolved during combustion of materials from cables - Part 1: Determination of the amount of halogen acid gas

IEC60751:2008 工业铂热电阻及铂感温元件Industrial platinum resistance thermometers and platinum temperature sensors

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IEC60749-6:2017 半导体器件机械和气候试验方法第6部分:高温存储寿命Semiconductor devices - Mechanical and climatic test methods - Part 6: Storage at high temperature

IEC60749-5:2023 半导体器件机械和气候试验方法第5部分:稳态湿热偏置寿命试验Semiconductor devices-Mechanical and climatic test methods-Part 5: Steady-state temperature humidity bias life test

IEC60749-5:2017 半导体器件机械和气候试验方法第5部分:稳态温湿度偏置寿命试验Semiconductor devices - Mechanical and climatic test methods - Part 5: Steady-state temperature humidity bias life test

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IEC60749-4:2017 半导体器件.机械和气候试验方法.第4部分:湿热､稳态､高加速应力试验(HAST)Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

IEC60749-4:2002 半导体器件机械和气候试验方法第4部分:强加速稳态湿热试验(HAST)Semiconductor devices - Mechanical and climatic test methods - Part 4: Damp heat, steady state, highly accelerated stress test (HAST)

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IEC60749-34:2010 半导体器件机械和气候试验方法第34部分:功率循环Semiconductor devices - Mechanical and climatic test methods - Part 34: Power cycling

IEC60749-29:2011 半导体器件-机械和气候测试方法-第29部分:闩锁测试Semiconductor devices - Mechanical and climatic test methods - Part 29: Latch-up test

IEC60749-28:2022 半导体器件机械和气候试验方法第28部分:静电放电(ESD)灵敏度试验带电器件模型(CDM)器件级Semiconductor devices - Mechanical and climatic test methods - Part 28: Electrostatic discharge (ESD) sensitivity testing - Charged device model (CDM) - device level

IEC60749-26:2025 半导体器件-机械和气候试验方法-第26部分:静电放电(ESD)灵敏度测试-人体模型(HBM)Semiconductor devices - Mechanical and climatic test methods - Part 26: Electrostatic discharge (ESD) sensitivity testing - Human body model (HBM)

IEC60749-25:2003 半导体器件机械和气候试验方法第25部分:温度循环Semiconductor devices - Mechanical and climatic test methods - Part 25: Temperature cycling

IEC60749-23:2004+A1:2011 半导体器件机械和气候试验方法第23部分:高温工作寿命Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

IEC60749-23:2004/AMD1:2011 修改件1半导体器件机械和气候试验方法第23部分:高温工作寿命Amendment 1 - Semiconductor devices - Mechanical and climatic test methods - Part 23: High temperature operating life

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IEC60749-1:2002 半导体器件机械和气候试验方法第1部分:总则Semiconductor devices - Mechanical and climatic test methods - Part 1: General

IEC60748-11:1990 半导体器件集成电路第11部分:半导体集成电路分规范(不包括混合电路)Semiconductor devices - Integrated circuits - Part 11: Sectional specification for semiconductor integrated circuits excluding hybrid circuits

IEC60747-9:2019 半导体器件分立器件第9部分:绝缘栅双极晶体管(IGBT)Semiconductor devices - Part 9- Discrete devices - Insulated-gate bipolar transistors (IGBTs)

IEC60747-9:2007 半导体器件分立器件第9部分:绝缘栅双极晶体管(IGBTs)Semiconductor devices - Discrete devices - Part 9: Insulated-gate bipolar transistors (IGBTs)

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IEC60747-8:2010 半导体器件-分立器件-第8部分:场效应晶体管Semiconductor devices - Discrete devices - Part 8: Field-effect transistors

IEC60747-5-5:2020 半导体器件.第5-5部分:光电子器件.光电耦合器Semiconductor devices - Part 5-5: Optoelectronic devices - Photocouplers

IEC60747-2:2016 半导体器件第2部分:分立器件整流二极管Semiconductor devices - Part 2: Discrete devices - Rectifier diodes

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IEC60747-2:2000 半导体器件分立器件和集成电路第2部分:整流二极管Semiconductor devices - Discrete devices and integrated circuits - Part 2: Rectifier diodes

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IEC60747-17:2020 半导体器件.第17部分:基本绝缘和增强绝缘用磁性和电容性耦合器Semiconductor devices - Part 17: Magnetic and capacitive coupler for basic and reinforced insulation

IEC60747-15:2024 半导体器件第15部分:分立器件绝缘型半导体器件Semiconductor devices-Part 15-Discrete devices-Isolated power semiconductor devices

IEC60747-15:2010 半导体器件分立器件第15部分:隔离式功率半导体器件Semiconductor devices - Discrete devices - Part 15: Isolated power semiconductor devices

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IEC60745-2-9:2008 手持式电动工具的安全第2部分:攻丝机的专用要求Hand-held motor-operated electric tools - Safety - Part 2-9: Particular requirements for tappers

IEC60745-2-8:2003+A1:2008 手持式电动工具的安全第2部分:电剪刀和电冲剪的专用要求Hand-held motor-operated electric tools - Safety -- Part 2-8: Particular requirements for shears and nibblers

IEC60745-2-6:2008 手持式电动工具的安全第2部分:锤类工具的专用要求Hand-held motor-operated electric tools - Safety - Part 2-6: Particular requirements for hammers

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